International Microelectronics Assembly and Packaging Society

International Microelectronics Assembly and Packaging Society (IMAPS) is a society based in Durham, North Carolina, dedicated to the advancement and growth of microelectronics and electronics packaging. With a small team of three employees, IMAPS generates an annual revenue of $2.5 million. IMAPS provides a range of educational and networking opportunities for industry professionals, packaging organizations, and students. These include technical conferences and workshops, professional development courses, and access to the IMAPSource microelectronics packaging research library. Local chapters also offer opportunities for members to connect and share their expertise. IMAPS covers a wide range of topics critical to microelectronics assembly and packaging. These areas span on-shoring, heterogeneous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, and substrates. You can learn more about IMAPS and its membership benefits by visiting their website at imaps.org.