Amkor Technology

Amkor Technology is a leading provider of outsourced semiconductor packaging and test services, headquartered in Tempe, Arizona. Founded in 1968, the company employs 1,331 individuals and generates annual revenue exceeding $1 billion. Amkor offers a comprehensive suite of services, encompassing package design and development, wafer probe and package testing, wafer bumping and redistribution, assembly, and final testing. Their expertise spans various packaging formats, including wafer-level, CSP, BGA, and leadframe, along with advanced 3D packaging solutions. Amkor distinguishes itself through its commitment to technological innovation, consistently introducing cutting-edge package formats such as advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). Their 3D configurations, including Package-on-Package, stacked CSP and BGA, and die stacks integrating various flip chip and wire bond interconnect technologies, solidify their position as a leader in the industry. Customers seeking to engage Amkor can visit their website at amkor.com.